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| Laser Type | Nanosecond Infrared/Nanosecond Green Laser |
| Processing Area | 650mmx550mm (Customized) |
| Machine Size | 1800mmx1600mmx1850mm |
| Processing Accuracy | ±0.02mm |
| Machine Power | 4500W |
| Environmental Condition | Humidity: 30% to 60%; Temperature: 22ºC ± 2 |
- Glass processing: high-precision drilling and cutting of glass covers and camera lenses.
- Flexible circuit board (FPC/PCB): laser drilling, cutting, and marking.
- Optical components: Precise processing of sapphire and filter plates.
- Automotive glass: drilling and irregular cutting of windshields and rearview mirrors.
- Power battery: Laser processing of battery pole pieces and separators.
- Medical devices: precision micro-pore processing of glassware and microfluidic chips.
- Optical devices: High-precision drilling and cutting of optical lenses and fiber optic connectors.







