The ZY-Z3 UV laser marking machine is a next-generation system utilizing advanced laser technology. By employing a 355nm UV laser and a high-speed scanning galvanometer system, it achieves superior marking precision. With high electro-optical conversion efficiency and third-order intracavity frequency doubling technology, the machine produces an exceptionally small focused spot.

This "cold light" processing method breaks molecular chains directly through short-wavelength laser light, minimizing mechanical deformation and thermal impact. It is ideal for ultra-fine marking, engraving, and applications such as medical packaging, micropore drilling, and complex cutting of silicon wafers.

• Ultra-fine processing market: Surface marking for medicine bottles, cosmetics, and polymer materials.
• Electronics: Flexible PCB board marking, dicing, and silicon wafer micro-hole processing.
• Glass & Materials: LCD glass QR code marking, glassware surface drilling, and metal surface coating marking.
• General Industry: Plastic buttons, electronic components, gifts, communication equipment, and building materials.

• High beam quality and extremely small spot for ultra-fine marking results.
• Non-contact process ensures no mechanical deformation or material burning.
• Software compatibility with AutoCAD, CorelDRAW, and Photoshop.
• Supports PLT, DXF, BMP, JPG, and TTF fonts directly.
• CCD automatic identification and tracking for high-precision positioning.
• Suitable for almost all materials except copper due to high absorption of 355nm UV light.